JPH061388Y2 - 表皮材成形用金型 - Google Patents
表皮材成形用金型Info
- Publication number
- JPH061388Y2 JPH061388Y2 JP9377889U JP9377889U JPH061388Y2 JP H061388 Y2 JPH061388 Y2 JP H061388Y2 JP 9377889 U JP9377889 U JP 9377889U JP 9377889 U JP9377889 U JP 9377889U JP H061388 Y2 JPH061388 Y2 JP H061388Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- skin material
- molding
- die
- heat shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 39
- 238000000465 moulding Methods 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 15
- 238000001816 cooling Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000498 cooling water Substances 0.000 description 5
- 238000005338 heat storage Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Instrument Panels (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9377889U JPH061388Y2 (ja) | 1989-08-09 | 1989-08-09 | 表皮材成形用金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9377889U JPH061388Y2 (ja) | 1989-08-09 | 1989-08-09 | 表皮材成形用金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0336423U JPH0336423U (en]) | 1991-04-09 |
| JPH061388Y2 true JPH061388Y2 (ja) | 1994-01-12 |
Family
ID=31643145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9377889U Expired - Lifetime JPH061388Y2 (ja) | 1989-08-09 | 1989-08-09 | 表皮材成形用金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH061388Y2 (en]) |
-
1989
- 1989-08-09 JP JP9377889U patent/JPH061388Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0336423U (en]) | 1991-04-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |